Fundamentals of device and systems packaging: technologies and applications

By:

Tummala, Rao R

Publication details: McGraw Hill Education India, 2020. Chennai:Edition: 2nd edDescription: xx, 828p.: ill.; hbk; 25cmISBN:

9789390385515

Subject(s):

DDC classification:

621.381046 TUM

Summary: A thoroughly revised, comprehensive guide to microelectronic device and systems packaging. This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law. https://www.accessengineeringlibrary.com/content/book/9781259861550

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Item type	Current library	Collection	Call number	Copy number	Status	Date due	Barcode
Books	IIT Gandhinagar	General	621.381046 TUM (Browse shelf(Opens below))	1	Available		032614

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Includes index and references

A thoroughly revised, comprehensive guide to microelectronic device and systems packaging.

This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law.

https://www.accessengineeringlibrary.com/content/book/9781259861550

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