Fundamentals of device and systems packaging: technologies and applications
Tummala, Rao R.
Fundamentals of device and systems packaging: technologies and applications - 2nd ed. - Chennai: McGraw Hill Education India, 2020. - xx, 828p.: ill.; hbk; 25cm.
Includes index and references
A thoroughly revised, comprehensive guide to microelectronic device and systems packaging.
This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law.
https://www.accessengineeringlibrary.com/content/book/9781259861550
9789390385515
Electronic packaging
Microelectronics
Miniature electronic equipment
Electronics--Engineering
621.381046 / TUM
Fundamentals of device and systems packaging: technologies and applications - 2nd ed. - Chennai: McGraw Hill Education India, 2020. - xx, 828p.: ill.; hbk; 25cm.
Includes index and references
A thoroughly revised, comprehensive guide to microelectronic device and systems packaging.
This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law.
https://www.accessengineeringlibrary.com/content/book/9781259861550
9789390385515
Electronic packaging
Microelectronics
Miniature electronic equipment
Electronics--Engineering
621.381046 / TUM
