Fundamentals of device and systems packaging: technologies and applications (Record no. 58466)
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000 -LEADER | |
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fixed length control field | 01597 a2200217 4500 |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
fixed length control field | 221222b |||||||| |||| 00| 0 eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
International Standard Book Number | 9789390385515 |
082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
Classification number | 621.381046 |
Item number | TUM |
100 ## - MAIN ENTRY--PERSONAL NAME | |
Personal name | Tummala, Rao R. |
245 ## - TITLE STATEMENT | |
Title | Fundamentals of device and systems packaging: technologies and applications |
250 ## - EDITION STATEMENT | |
Edition statement | 2nd ed. |
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
Name of publisher, distributor, etc | McGraw Hill Education India, |
Date of publication, distribution, etc | 2020. |
Place of publication, distribution, etc | Chennai: |
300 ## - PHYSICAL DESCRIPTION | |
Extent | xx, 828p.: |
Other physical details | ill.; hbk; |
Dimensions | 25cm. |
504 ## - BIBLIOGRAPHY, ETC. NOTE | |
Bibliography, etc | Includes index and references |
520 ## - SUMMARY, ETC. | |
Summary, etc | A thoroughly revised, comprehensive guide to microelectronic device and systems packaging.<br/><br/>This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law.<br/><br/>https://www.accessengineeringlibrary.com/content/book/9781259861550 |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Electronic packaging |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Microelectronics |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Miniature electronic equipment |
650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
Topical term or geographic name as entry element | Electronics--Engineering |
942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
Source of classification or shelving scheme | Dewey Decimal Classification |
Item type | Books |
Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Collection code | Home library | Current library | Date acquired | Source of acquisition | Cost, normal purchase price | Total Checkouts | Total Renewals | Full call number | Barcode | Date last seen | Date last borrowed | Copy number | Cost, replacement price | Koha item type |
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Dewey Decimal Classification | General | IIT Gandhinagar | IIT Gandhinagar | 22/12/2022 | CBS Books | 0.00 | 5 | 1 | 621.381046 TUM | 032614 | 24/05/2024 | 04/12/2023 | 1 | 15064.18 | Books |