Sip system-in-package design and simulation: mentor EE flow advanced design guide

By:

Suny Li (Li Yang)

Material type:

TextPublication details: Wiley, 2024.ISBN:

9781119046011

Subject(s):

DDC classification:

621.38152 SUN

Online resources:

Click here to access e-book

Summary: An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

List(s) this item appears in: IEEE-Wiley Semiconductor Ebooks

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Item type	Current library	Call number	Materials specified	URL	Status
E- Books	IIT Gandhinagar	621.38152 SUN (Browse shelf(Opens below))	IEEE-Wiley Semiconductor Ebooks	Link to resource	Available

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow

Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture.

Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:

Cavity and sacked dies design
FlipChip and RDL design
Routing and coppering
3D Real-Time DRC check
SiP simulation technology
Mentor SiP Design and Simulation Platform
Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

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