000			01525nam a2200205 4500
020			_a9783527644247
082			_a621.38152 RAM
100			_aRamm, Peter
245			_aHandbook of wafer bonding
260			_bWiley, _c2024.
520			_aFocus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
650			_aCircuits
650			_aDevices
650			_aDielectrics
650			_aPlasmas
700			_aJames Jian-Qiang Lu _eCo editor
700			_aTaklo, Maaike M. V _eCo editor
856			_uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=10518219 _yClick here to access e-book
942			_2ddc _cE
999			_c63086 _d63086