| 000 | 02132nam a2200217 4500 | ||
|---|---|---|---|
| 005 | 20250613112544.0 | ||
| 020 | _a9781119459989 | ||
| 082 | _a537.622 MIT | ||
| 100 | _aMittal, K. L. (Ed.) | ||
| 245 | _aAdvances in contact angle, wettability and adhesion, volume 3 | ||
| 260 |
_bWiley, _c2024 |
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| 504 | _aIncludes index | ||
| 520 | _aThe present volume constitutes Volume 3 in the ongoing series Advances in Contact Angle, Wettability and Adhesion, which was conceived with the intent to provide periodic updates on the research activity and salient developments in the fascinating arena of contact angle, wettability, and adhesion. The book is divided into four parts: Part 1: Contact Angle Measurement and Analysis; Part 2: Wettability Behavior; Part 3: Superhydrophobic Surfaces; Part 4: Wettability, Surface Free Energy and Adhesion. The topics covered include: procedure to measure and analyse contact angle/drop shape behaviors; contact angle measurement considering spreading, evaporation and reactive substrate; measurement of contact angle of a liquid on a substrate of the same liquid; evolution of axisymmetric droplet shape parameters; interfacial modulus of a solid surface; functionalization of textiles using UV-based techniques for surface modification--patterned wetting behavior; wettability behavior of oleophilic and oleophobic nanorough surfaces; wettability behavior of nanofluids; dielectrowetting for digital microfluidics; hydrophobicity and superhydrophobicity in fouling prevention; superhydrophobic/superhydrophilic hybrid surface; determination of the surface free energy of solid surfaces: statistical considerations; determination of apparent surface free energy using hysteresis approach; wettability correlations for bioadhesion to different materials; laser material processing for enhancing stem cell adhesion and growth. | ||
| 650 | _aCircuits | ||
| 650 | _aEngineered Materials | ||
| 650 | _aSuperhydrophobic | ||
| 650 | _aDielectrics | ||
| 650 | _aPlasmas | ||
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_uhttps://ieeexplore.ieee.org/servlet/opac?bknumber=10523070 _yClick here to access e-book |
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