Handbook of 3D integration, volume 4: design, test, and thermal management

By:

Franzon, Paul D. (Ed.)

Contributor(s):

Material type:

TextPublication details: Wiley, 2024.ISBN:

9783527697045

Subject(s):

DDC classification:

621.38152 FRA

Online resources:

Click here to access e-book

Summary: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

List(s) this item appears in: IEEE-Wiley Semiconductor Ebooks

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Holdings
Item type	Current library	Call number	Materials specified	URL	Status
E- Books	IIT Gandhinagar	621.38152 FRA (Browse shelf(Opens below))	IEEE-Wiley Semiconductor Ebooks	Link to resource	Available

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective.

Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

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