TY  - BOOK
AU  - Suny Li (Li Yang)
TI  - Sip system-in-package design and simulation: mentor EE flow advanced design guide
SN  - 9781119046011
U1  - 621.38152 SUN 
PY  - 2024///
PB  - Wiley
KW  - Components
KW  - Circuits
KW  - Devices and Systems
KW  - General Topics for Engineers
KW  - Dielectrics and Plasmas
KW  -  Engineered Materials
N1  - Include Index
N2  - An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow

Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. 

Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:  

Cavity and sacked dies design
FlipChip and RDL design
Routing and coppering
3D Real-Time DRC check
SiP simulation technology
Mentor SiP Design and Simulation Platform
Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
UR  - https://ieeexplore.ieee.org/book/10518287
ER  -