TY  - GEN
AU  - Tummala, Rao R.
TI  - Fundamentals of device and systems packaging: technologies and applications
SN  - 9789390385515
U1  - 621.381046 
PY  - 2020///
CY  - Chennai
PB  - McGraw Hill Education India
KW  - Electronic packaging
KW  - Microelectronics
KW  - Miniature electronic equipment
KW  - Electronics--Engineering
N1  - Includes index and references
N2  - A thoroughly revised, comprehensive guide to microelectronic device and systems packaging.

This fully updated resource offers complete coverage of the latest microelectronic device and systems packaging methods and applications. The book lays the groundwork for Moore's Law for packaging by showing how I/Os have evolved from one package family node to the next—from fewer than 16 I/Os in the 1960s to the current silicon interposers with about 200,000 I/Os. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, proposes a variety of ways to extend Moore's Law, including maximizing Si interposers and implementing glass panel embedding. You will get detailed discussions of cutting-edge technologies, including 3D opto-electronics and, ultimately, quantum computing, that could become the next Moore's Law.

https://www.accessengineeringlibrary.com/content/book/9781259861550
ER  -