Radojcic, Riko <br/><br/>
More-than-Moore 2.5D and 3D SiP integration 

 - Cham:  Springer,  2017 
 - xv, 182 p.:  ill;   24 cm. 
<br/><br/> Includes bibliographical references and index.<br/> 
<br/><br/><label>ISBN: </label>9783319525471 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Engineering.  <br/>Systems integration.<br/>Embedded computer systems. <br/> Electronic Circuits and Devices.<br/>Circuits and Systems.<br/> Processor Architectures.<br/>Electronic circuits. <br/>Microprocessors. 
<br/><br/><label>Dewey Class. No.: </label>620  / RAD