Wafer manufacturing: shaping of single crystal silicon

By:

Kao, Imin

Contributor(s):

Chung, Chunhui [Co-author]

Publication details: New Jersey: Wiley, 2021.Description: xiv, 290p.: ill.; hbk.: 24cmISBN:

9780470061213

Subject(s):

DDC classification:

621.38152 KAO

Summary: This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing. https://www.wiley.com/en-us/Wafer+Manufacturing%3A+Shaping+of+Single+Crystal+Silicon+Wafers-p-9780470061213

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Item type	Current library	Collection	Call number	Copy number	Status	Date due	Barcode
Books	IIT Gandhinagar	General	621.38152 KAO (Browse shelf(Opens below))	1	Available		033968

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Previous	621.38152 CHE Semiconductor packaging: materials interaction and reliability	621.38152 DUT Semiconductor devices and circuits	621.38152 GRE Semiconductor quantum dots: organometallic and inorganic synthesis	621.38152 KAO Wafer manufacturing: shaping of single crystal silicon	621.38152 KOH Electronic processes in organic semiconductors: an introduction	621.38152 LAU Semiconductor advanced packaging	621.38152 LUN Fundamentals of carrier transport	Next

Includes Summary & Reference

This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

https://www.wiley.com/en-us/Wafer+Manufacturing%3A+Shaping+of+Single+Crystal+Silicon+Wafers-p-9780470061213

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