MXene reinforced polymer composites: fabrication, characterization and applications (Record no. 63148)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02318nam a2200241 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781119901273 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38152 DES |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Deshmukh, Kalim |
| 245 ## - TITLE STATEMENT | |
| Title | MXene reinforced polymer composites: fabrication, characterization and applications |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Name of publisher, distributor, etc. | Wiley, |
| Date of publication, distribution, etc. | 2024. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | MXene Reinforced Polymer Composites<br/><br/>This volume is the first book to comprehensively explore the various fabrication and processing strategies for MXene-reinforced polymer composites including detailed characterizations and their numerous applications.<br/><br/>The book systematically provides a critical discussion on the synthesis and processing methods, structure, properties, characterizations, surface chemistry, and functionalization strategies of MXenes and their utilization as efficient nanofiller into various polymer matrices to form high-performance polymer composites. The book provides a deep insight into the recent state-of-the-art progress in MXene-reinforced polymer composites, discussing several critical issues and providing suggestions for future work. The key features of this book are:<br/><br/>Providing fundamental information and a clear understanding of the synthesis, processing, compositions, structure, and physicochemical properties of MXenes;<br/>Presenting a comprehensive review of several recent accomplishments and key scientific and technological challenges in developing MXene-reinforced polymer composites;<br/>Exploring various processing and fabrication methods of MXene-reinforced polymer composites;<br/>Providing deep insight into fundamental properties and various emerging applications of MXene-reinforced polymer/composites.<br/>Audience<br/><br/>Researchers, postgraduates, and industry engineers working in materials science, polymer science, materials engineering, and nanotechnology, as well as technologists in electronic, electrical, and biomedical industries. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Circuits |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Devices |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Computing |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | IEEE-Wiley Semiconductor Ebooks |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Engineered Material |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Dielectrics |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Plasmas |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Pandey, Mayank |
| Relator term | Co editor |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Hussain, Chaudhery Mustansar |
| Relator term | Co editor |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://ieeexplore.ieee.org/servlet/opac?bknumber=10554378">https://ieeexplore.ieee.org/servlet/opac?bknumber=10554378</a> |
| Link text | Click here to access e-book |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| Koha item type | E- Books |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Materials specified (bound volume or other part) | Damaged status | Not for loan | Home library | Current library | Date acquired | Total Checkouts | Full call number | Date last seen | Uniform Resource Identifier | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Dewey Decimal Classification | IEEE-Wiley Semiconductor Ebooks | IIT Gandhinagar | IIT Gandhinagar | 30/06/2025 | 621.38152 DES | 30/06/2025 | https://ieeexplore.ieee.org/servlet/opac?bknumber=10554378 | 30/06/2025 | E- Books |
