Handbook of wafer bonding (Record no. 63086)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 01525nam a2200205 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9783527644247 |
| 082 ## - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38152 RAM |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Ramm, Peter |
| 245 ## - TITLE STATEMENT | |
| Title | Handbook of wafer bonding |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. | |
| Name of publisher, distributor, etc. | Wiley, |
| Date of publication, distribution, etc. | 2024. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.<br/><br/>Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.<br/><br/>This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries. |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Circuits |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Devices |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Dielectrics |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Plasmas |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | James Jian-Qiang Lu |
| Relator term | Co editor |
| 700 ## - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Taklo, Maaike M. V |
| Relator term | Co editor |
| 856 ## - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="https://ieeexplore.ieee.org/servlet/opac?bknumber=10518219">https://ieeexplore.ieee.org/servlet/opac?bknumber=10518219</a> |
| Link text | Click here to access e-book |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Dewey Decimal Classification |
| Koha item type | E- Books |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Materials specified (bound volume or other part) | Damaged status | Not for loan | Home library | Current library | Date acquired | Total Checkouts | Full call number | Date last seen | Uniform Resource Identifier | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Dewey Decimal Classification | IEEE-Wiley Semiconductor Ebooks | IIT Gandhinagar | IIT Gandhinagar | 20/06/2025 | 621.38152 RAM | 20/06/2025 | https://ieeexplore.ieee.org/servlet/opac?bknumber=10518219 | 20/06/2025 | E- Books |
